{"id":789,"date":"2026-06-18T14:27:58","date_gmt":"2026-06-18T14:27:58","guid":{"rendered":"https:\/\/ids-global.solutions\/home\/?page_id=789"},"modified":"2026-06-18T15:07:18","modified_gmt":"2026-06-18T15:07:18","slug":"custom-multi-layer-pcb","status":"publish","type":"page","link":"https:\/\/ids-global.solutions\/home\/custom-multi-layer-pcb\/","title":{"rendered":"Custom Multi-Layer PCB"},"content":{"rendered":"\t\t
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Case Study 01<\/h2>\t\t\t\t<\/div>\n\t\t\t\t
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Custom Multi-Layer PCB for Communication Systems<\/h2>\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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\n\t\t\t\t\t\t\n\t\t\t\t\t\t\tCase Study 01\t\t\t\t\t\t<\/a>\n\t\t\t\t\t<\/h3>\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t

\n\t\t\t\t\t\tCustom Multi-Layer PCB for Communication Systems\t\t\t\t\t<\/p>\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t

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\n\t\t\t\t\t\t\n\t\t\t\t\t\t\tChallenge\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/h3>\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t

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\n A European telecommunications client required a high-frequency, multi-layer PCB design for a next-generation communication module.\n <\/p>\n\n

\n The project demanded:\n <\/p>\n\n

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  • 12-layer HDI PCB with strict impedance control<\/li>\n
  • Rare material specification (low-loss dielectric)<\/li>\n
  • Compliance with both European and Asian manufacturing standards<\/li>\n
  • Ability to prototype quickly while maintaining tight tolerances<\/li>\n
  • A stable supply chain for ongoing production<\/li>\n <\/ul>\n\n
    \n Multiple suppliers had previously rejected the project due to its technical complexity, long material lead time, and precision fabrication requirements.\n <\/div>\n\n<\/div>\t\t\t\t\t<\/p>\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t
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    \n\n

    \n We approached the challenge through a structured, cross-regional execution strategy:\n <\/p>\n\n

    \n 1. Technical Requirement Breakdown\n <\/p>\n\n

      \n
    • 12-layer HDI PCB with strict impedance control<\/li>\n
    • Rare material specification (low-loss dielectric)<\/li>\n
    • Compliance with both European and Asian manufacturing standards<\/li>\n
    • Ability to prototype quickly while maintaining tight tolerances<\/li>\n
    • A stable supply chain for ongoing production<\/li>\n <\/ul>\n\n

      \n 2. Supplier Capability Mapping\n <\/p>\n\n

        \n
      • \n Matched the PCB requirements with highly specialized manufacturers in Asia experienced in HDI and controlled impedance processes.\n <\/li>\n
      • \n Conducted internal DFM reviews to minimize fabrication risk.\n <\/li>\n <\/ul>\n\n

        \n 3. Material Sourcing Optimization\n <\/p>\n\n

          \n
        • \n Secured a reliable supply of the required low-loss dielectric materials that meet EU environmental compliance (RoHS \/ REACH).\n <\/li>\n
        • \n Arranged material reservations to stabilize future production.\n <\/li>\n <\/ul>\n\n

          \n 4. Prototype \u2192 Validation \u2192 Production\n <\/p>\n\n

            \n
          • Delivered prototypes within the compressed timeframe.<\/li>\n
          • Provided full inspection data (stack-up, microsection, impedance reports).<\/li>\n
          • Transitioned seamlessly into small-batch production.<\/li>\n <\/ul>\n\n<\/div>\t\t\t\t\t<\/p>\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t
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            \n\t\t\t\t\t\t\n\t\t\t\t\t\t\tResults\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/h3>\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t

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            \n\n

            \n 1. Delivered high-precision PCB prototypes \n 20% faster<\/span> \n than the client's expected timeline.\n <\/p>\n\n

            \n 2. Achieved \n near-zero impedance deviation<\/span> \n in validation.\n <\/p>\n\n

            \n 3. Established a long-term production workflow, ensuring cost stability and material availability.\n <\/p>\n\n

            \n 4. The client adopted the PCB as the core component in its new communication product line.\n <\/p>\n\n<\/div>\t\t\t\t\t<\/p>\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

            Case Study 01 Custom Multi-Layer PCB for Communication Systems Case Study 01 Custom Multi-Layer PCB for Communication Systems Challenge A European telecommunications client required a high-frequency, multi-layer PCB design for a next-generation communication module. The project demanded: 12-layer HDI PCB with strict impedance control Rare material specification (low-loss dielectric) Compliance with both European and Asian […]<\/p>\n","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"elementor_header_footer","meta":{"footnotes":""},"class_list":["post-789","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/ids-global.solutions\/home\/wp-json\/wp\/v2\/pages\/789","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ids-global.solutions\/home\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/ids-global.solutions\/home\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/ids-global.solutions\/home\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/ids-global.solutions\/home\/wp-json\/wp\/v2\/comments?post=789"}],"version-history":[{"count":10,"href":"https:\/\/ids-global.solutions\/home\/wp-json\/wp\/v2\/pages\/789\/revisions"}],"predecessor-version":[{"id":814,"href":"https:\/\/ids-global.solutions\/home\/wp-json\/wp\/v2\/pages\/789\/revisions\/814"}],"wp:attachment":[{"href":"https:\/\/ids-global.solutions\/home\/wp-json\/wp\/v2\/media?parent=789"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}